Sub-thermal switching slope vertical field effect transistor with dual-gate feedback loop mechanism

ABSTRACT

Fabricating a feedback field effect transistor includes receiving a semiconductor structure including a substrate, a first source/drain disposed on the substrate, a fin disposed on the first source/drain, and a hard mask disposed on a top surface of the fin. A bottom spacer is formed on a portion of the first source/drain. A first gate is formed upon the bottom spacer. A sacrificial spacer is formed upon the first gate, a gate spacer is formed on the first gate from the sacrificial spacer, and a second gate is formed on the gate spacer. The gate spacer is disposed between the first gate and the second gate. A top spacer is formed around portions of the second gate and hard mask, a recess is formed in the top spacer and hard mask, and a second source/drain is formed in the recess.

TECHNICAL FIELD

The present invention relates generally to a method for fabricating avertical field effect transistor and an apparatus formed by the method.More particularly, the present invention relates to a method forfabricating a vertical field effect transistor with dual-gate feedbackloop mechanism exhibiting sub-kT/q sub-threshold slope and an apparatusformed by the method.

BACKGROUND

An integrated circuit (IC) is an electronic circuit formed using asemiconductor material, such as Silicon, as a substrate and by addingimpurities to form solid-state electronic devices, such as transistors,diodes, capacitors, and resistors. Commonly known as a “chip” or a“package”, an integrated circuit is generally encased in rigid plastic,forming a “package”. The components in modern day electronics generallyappear to be rectangular black plastic packages with connector pinsprotruding from the plastic encasement. Often, many such packages areelectrically coupled so that the chips therein form an electroniccircuit to perform certain functions.

The software tools used for designing ICs produce, manipulate, orotherwise work with the circuit layout and circuit components on verysmall scales. Some of the components that such a tool may manipulate mayonly measure tens of nanometer across when formed in Silicon. Thedesigns produced and manipulated using these software tools are complex,often including hundreds of thousands of such components interconnectedto form an intended electronic circuitry.

A layout includes shapes that the designer selects and positions toachieve a design objective. The objective is to have the shape—thetarget shape—appear on the wafer as designed. However, the shapes maynot appear exactly as designed when manufactured on the wafer throughphotolithography. For example, a rectangular shape with sharp cornersmay appear as a rectangular shape with rounded corners on the wafer.

Once a design layout, also referred to simply as a layout, has beenfinalized for an IC, the design is converted into a set of masks orreticles. A set of masks or reticles is one or more masks or reticles.During manufacture, a semiconductor wafer is exposed to light orradiation through a mask to form microscopic components of the IC. Thisprocess is known as photolithography.

A manufacturing mask is a mask usable for successfully manufacturing orprinting the contents of the mask onto wafer. During thephotolithographic printing process, radiation is focused through themask and at certain desired intensity of the radiation. This intensityof the radiation is commonly referred to as “dose”. The focus and thedosing of the radiation is controlled to achieve the desired shape andelectrical characteristics on the wafer.

A Field Effect Transistor (FET) is a semiconductor device that hascontrols the electrical conductivity between a source of electriccurrent (source) and a destination of the electrical current (drain).The FET uses a semiconductor structure called a “gate” to create anelectric field, which controls the free charged carriers andconsequently the electrical conductivity of a channel between the sourceand the drain. The channel is a charge carrier pathway constructed usinga semiconductor material. A vertical field effect transistor (VFET) is aFET having a fin structure disposed on a semiconductor substrate andextending vertically from the substrate. In the VFET the channel extendsvertically from a source/drain region disposed on substrate.

SUMMARY

The illustrative embodiments provide a method and apparatus. Anembodiment of a method for fabricating a feedback field effecttransistor includes receiving a semiconductor structure including asubstrate, a first source/drain disposed on the substrate, a findisposed on the first source/drain, and a hard mask disposed on a topsurface of the fin. The embodiment further includes forming a bottomspacer on a portion of the first source/drain. The embodiment furtherincludes forming a first gate upon the bottom spacer. The embodimentfurther includes forming a sacrificial spacer upon the first gate,forming a gate spacer on the first gate from the sacrificial spacer, andforming a second gate on the gate spacer, the gate spacer disposedbetween the first gate and the second gate. The embodiment furtherincludes forming a top spacer around portions of the second gate andhard mask, forming a recess in the top spacer and hard mask, and forminga second source/drain in the recess.

An embodiment further includes depositing a dielectric material uponportions of the bottom spacer, first gate, and second gate. In anembodiment, the dielectric material includes an inter-layer dielectricmaterial. An embodiment further includes forming a first gate contactwithin the dielectric material and in contact with the first gate, andforming a second gate contact within the dielectric material and incontract with the second gate. The embodiment further includes forming afirst source/drain contact within the dielectric material and in contactwith the first source/drain, and forming a second source/drain contactwithin the dielectric material and in contact with the secondsource/drain.

In an embodiment forming the first gate further includes depositing aconformal gate material upon the bottom spacer and portions of the fin,and recessing a portion of the gate material upon the bottom spacer toform the first gate. In an embodiment, forming the second gate furtherincludes depositing a conformal gate material upon a top surface of thesacrificial spacer, and recessing a portion of the gate material to formthe second gate.

In an embodiment, the first source/drain is formed of an n-typesemiconductor material. In an embodiment, the second source/drain isformed of a p-type semiconductor material. In an embodiment, the firstgate is formed of a high dielectric constant gate material. In anembodiment, the gate spacer is formed of a silicon nitride (SiN)material.

An embodiment of a method for fabricating a feedback field effecttransistor includes receiving a semiconductor structure including asubstrate, a first source/drain disposed on the substrate, a findisposed on the first source/drain, and a hard mask disposed on a topsurface of the fin. The embodiment further includes forming a bottomspacer on a portion of the first source/drain, depositing a firstdielectric layer on the bottom spacer, and forming a gate spacer uponthe first dielectric layer. The embodiment further includes depositing asecond dielectric layer on the gate spacer, forming a top spacer on thesecond dielectric layer, and forming a sidewall spacer on the top spaceraround a portion of the hard mask. The embodiment further includesdepositing a gate material on portions of the bottom spacer, the fin,and the gate spacer, forming a first gate between the bottom spacer andgate spacer by removing portions of the gate material, and forming asecond gate between the gate spacer and the top spacer by removingportions of the gate material. The embodiment further includes forming arecess in the sidewall spacer and hard mask, and forming a secondsource/drain in the recess.

An embodiment further includes depositing a first contact material incontact with the first gate, depositing a first dielectric material incontact with the first contact material, and depositing a second contactmaterial on the first dielectric material in contact with the secondgate. In an embodiment, the first contact material includes tungsten. Inan embodiment, the dielectric material includes an inter-layerdielectric material.

An embodiment further includes forming a first gate contact within thefirst dielectric material and in contact with the first contactmaterial, and forming a second gate contact within the first dielectricmaterial and in contract with the second contact material.

An embodiment further includes forming a first source/drain contactwithin the first dielectric material and in contact with the firstsource/drain, and forming a second source/drain contact within the firstdielectric material and in contact with the second source/drain.

An embodiment of a method for fabricating a feedback field effecttransistor includes receiving a semiconductor structure including asubstrate and a first source/drain disposed on the substrate, andforming a bottom spacer on a portion of the first source/drain. Theembodiment further includes depositing a first dielectric layer on thebottom spacer, forming a gate spacer upon the first dielectric layer,and depositing a second dielectric layer on the gate spacer. Theembodiment further includes forming a top spacer on the seconddielectric layer, and depositing a third dielectric layer upon the topspacer. The embodiment further includes forming a fin trench through thethird dielectric layer, the top spacer, the second dielectric layer, thegate spacer, the first dielectric layer, and the bottom spacer to a topsurface of the first source/drain. The embodiment further includesforming a fin within the fin trench, forming a second source/drain on atop surface of the fin, and forming a hard mask on a top surface of thesecond source/drain. The embodiment further includes removing portionsof the third dielectric layer, the top spacer, the second dielectriclayer, the gate spacer, and the first dielectric layer. The embodimentfurther includes depositing a gate material on portions of the bottomspacer, the fin, and the gate spacer. The embodiment further includesforming a first gate between the bottom spacer and gate spacer byremoving portions of the gate material, and forming a second gatebetween the gate spacer and the top spacer by removing portions of thegate material.

An embodiment further includes forming a sidewall spacer on the topspacer around a portion of the hard mask. An embodiment further includesdepositing a first dielectric material on the bottom spacer in contactwith the first gate, and depositing a contact material on the firstdielectric material and in contact with the second gate. In anembodiment, the first contact material includes tungsten.

An embodiment further includes forming a first gate contact within thefirst dielectric material and in contact with the first gate, andforming a second gate contact within the first dielectric material andin contract with the contact material.

An embodiment further includes forming a first source/drain contactwithin the first dielectric material and in contact with the firstsource/drain, and forming a second source/drain contact within the firstdielectric material and in contact with the second source/drain.

An embodiment of an apparatus includes a semiconductor structureincluding a substrate, a first source/drain disposed on the substrate, afin disposed on the first source/drain, and a hard mask disposed on atop surface of the fin. The embodiment further includes a bottom spacerformed on a portion of the first source/drain, a first gate formed uponthe bottom spacer, a gate spacer disposed on the first gate, and asecond gate on the gate spacer, the gate spacer disposed between thefirst gate and the second gate. The embodiment further includes a topspacer disposed around portions of the second gate and hard mask, arecess formed in the top spacer and hard mask, and a second source/drainformed in the recess. An embodiment further includes a dielectricmaterial deposited upon portions of the bottom spacer, first gate, andsecond gate.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features believed characteristic of the invention are setforth in the appended claims. The invention itself, however, as well asa preferred mode of use, further objectives and advantages thereof, willbest be understood by reference to the following detailed description ofthe illustrative embodiments when read in conjunction with theaccompanying drawings, wherein:

FIG. 1 illustrates a simplified illustration of example operatingprinciples of a feedback FET (FB-FET);

FIG. 2 illustrates a simplified illustration of example operatingprinciples of the feedback FET (FB-FET) of FIG. 1 in n-FET and p-FEToperating configurations;

FIG. 3 depicts a portion of a process for fabricating a vertical fieldeffect transistor with dual-gate feedback loop mechanism (FB-VFET)according to an embodiment;

FIG. 4 depicts another portion of the process;

FIG. 5 depicts another portion of the process;

FIG. 6 depicts another portion of the process;

FIG. 7 depicts another portion of the process;

FIG. 8 depicts another portion of the process;

FIG. 9 depicts another portion of the process;

FIG. 10 depicts another portion of the process;

FIG. 11 depicts another portion of the process;

FIG. 12 depicts another portion of the process;

FIG. 13 depicts another portion of the process;

FIG. 14 depicts another portion of the process;

FIG. 15 depicts another portion of the process;

FIG. 16 depicts a top view of the VFET with dual-gate feedback loopmechanism of FIG. 15;

FIG. 17 depicts a flowchart of an example process for fabricating a VFETwith dual-gate feedback loop in accordance with an illustrativeembodiment;

FIG. 18 depicts another example process for fabricating a vertical fieldeffect transistor (VFET) with dual-gate feedback loop mechanism inaccordance with an embodiment;

FIG. 19 depicts another portion of the process;

FIG. 20 depicts another portion of the process;

FIG. 21 depicts another portion of the process;

FIG. 22 depicts another portion of the process;

FIG. 23 depicts another portion of the process;

FIG. 24 depicts another portion of the process;

FIG. 25 depicts another portion of the process;

FIG. 26 depicts another portion of the process;

FIG. 26A depicts another portion of the process;

FIG. 27 depicts another portion of the process;

FIG. 27A depicts another portion of the process;

FIG. 27B depicts another portion of the process;

FIG. 27C depicts another portion of the process;

FIG. 28 depicts another portion of the process;

FIG. 29 depicts another portion of the process;

FIG. 30 depicts another portion of the process;

FIG. 31 depicts another portion of the process;

FIG. 32 depicts another portion of the process;

FIG. 33 depicts a top view of the VFET with dual-gate feedback loop ofFIG. 32;

FIG. 34 depicts a flowchart of another example process for fabricating aVFET with dual-gate feedback loop in accordance with anotherillustrative embodiment;

FIG. 35 depicts another example process for fabricating a vertical fieldeffect transistor (VFET) with dual-gate feedback loop mechanism inaccordance with an embodiment;

FIG. 36 depicts another portion of the process;

FIG. 37 depicts another portion of the process;

FIG. 38 depicts another portion of the process;

FIG. 39 depicts another portion of the process;

FIG. 40 depicts another portion of the process;

FIG. 41 depicts another portion of the process;

FIG. 42 depicts another portion of the process;

FIG. 43 depicts another portion of the process;

FIG. 44 depicts another portion of the process;

FIG. 45 depicts another portion of the process;

FIG. 46 depicts another portion of the process;

FIG. 47 depicts another portion of the process;

FIG. 48 depicts a top view of the VFET with dual-gate feedback loop ofFIG. 47; and

FIG. 49 depicts a flowchart of another example process for fabricating aVFET with dual-gate feedback loop in accordance with anotherillustrative embodiment.

DETAILED DESCRIPTION

One or more embodiments of the present invention are directed to aprocess for fabricating a vertical field effect transistor (VFET) withdual-gate feedback loop mechanism (FB-VFET) and an apparatus formed bythe process. Conventional metal-oxide-semiconductor field effecttransistors (“MOSFETs”) typically have a subthreshold slope that isthermally limited to about 60-70 mV per decade at room temperature(about 300 Kelvin). In other words, for typical FET transistors,increasing the gate voltage by about 60 mV results in a correspondingdrain current increase of less than about a factor of 10. This limitedsubthreshold slope cannot provide arbitrarily fast transitions between“OFF” (low current) and “ON” (high current) states of the FETtransistor. Accordingly, the use of conventional FETs results in atrade-off between low power and high performance.

A semiconductor fabrication process typically includes afront-end-of-line (FEOL) stage, a middle-of-the-line (MOL) stage, andback-end-of-line (BEOL) stage. Typical FEOL processes include waferpreparation, well formation, channel formation, Shallow Trench Isolation(STI) formation, gate patterning, spacer, extension implantation,Source/Drain Epitaxy formation and implantation, and silicide formation.Typical MOL processes are mainly directed to source/drain (S/D) contact(CA) formation and gate contact (CB) formation. The MOL level ofsemiconductor manufacturing includes forming local interconnects withina device. In a typical MOL stage of a manufacturing process, aninterface material, such as nickel silicide, is deposited on the source,drain, and gate of a transistor structure and contacts are then formedon top of the structures. In a typical BEOL stage of a manufacturingprocess, interconnects are formed on top of the contacts formed duringthe MOL stage to interconnect individual transistors and/or othersemiconductor devices on the wafer.

One or more embodiments of the invention provide a VFET with a dual-gatefeedback loop mechanism (FB-VFET) in which a turn-on/turn-off mechanismbased upon a positive feedback loop between potential barriers andcharge carries in the channel of the VFET is achieved through adual-gate architecture. In one or more embodiments, the recursivefeedback loop enables for a sub-kT/q sub-threshold slope. In one or moreembodiments, a feedback loop FET device is provided that can operate inboth an n-type FET (nFET) and p-type FET (pFET) polarities by adjustinga voltage configuration of the dual-gate. In particular embodiments, thedual mode operational capabilities may lead to fabrication process flowsimplification compared to standard CMOS flow technologies.

An embodiment can be implemented as a software application. Theapplication implementing an embodiment can be configured as amodification of an existing fabrication system, as a separateapplication that operates in conjunction with an existing fabricationsystem, a standalone application, or some combination thereof. Forexample, the application causes the fabrication system to perform thesteps described herein, to fabricate feedback VFET devices as describedherein.

For the clarity of the description, and without implying any limitationthereto, the illustrative embodiments are described using a singlefeedback VFET (FB-VFET) device. An embodiment can be implemented with adifferent number of feedback VFETs within the scope of the illustrativeembodiments. Furthermore, a transistor channel of various embodimentscan have its shape and geometrical orientation other than the ones foundin the feedback VFETs described herein including but not limiting toplanar, surround-gate, multiple-gate, nano-wire or nano-sheet, andvertical channels. The feedback VFETs can be wired into a number ofuseful circuits such as CMOS logic circuits (e.g. NAND and NOR), memorycells (e.g. SRAM), analog circuits (e.g. PLL), and input/output (I/O)circuits.

Furthermore, simplified diagrams of the example feedback VFET devicesare used in the figures and the illustrative embodiments. In an actualfabrication of an feedback VFET device, additional structures that arenot shown or described herein may be present without departing the scopeof the illustrative embodiments. Similarly, within the scope of theillustrative embodiments, a shown or described structure in the examplefeedback VFET devices may be fabricated differently to yield a similaroperation or result as described herein.

Differently shaded portions in the two-dimensional drawing of theexample feedback VFETs are intended to represent different structures inthe example feedback VFETs, as described herein. The differentstructures may be fabricated using suitable materials that are known tothose of ordinary skill in the art.

A specific shape or dimension of a shape depicted herein is not intendedto be limiting on the illustrative embodiments. The shapes anddimensions are chosen only for the clarity of the drawings and thedescription and may have been exaggerated, minimized, or otherwisechanged from actual shapes and dimensions that might be used in actuallyfabricating a feedback VFET according to the illustrative embodiments.

Furthermore, the illustrative embodiments are described with respect toa feedback VFET only as an example. The steps described by the variousillustrative embodiments can be adapted for fabricating other planar andnon-planar devices, and such adaptations are contemplated within thescope of the illustrative embodiments.

An embodiment when implemented in a software application causes afabrication system to performs certain steps as described herein. Thesteps of the fabrication process are depicted in the several figures.Not all steps may be necessary in a particular fabrication process. Somefabrication processes may implement the steps in different order,combine certain steps, remove or replace certain steps, or perform somecombination of these and other manipulations of steps, without departingthe scope of the illustrative embodiments.

A method of an embodiment described herein, when implemented to executeon a manufacturing device, tool, or data processing system, comprisessubstantial advancement of the functionality of that manufacturingdevice, tool, or data processing system in fabricating feedback VFETsdevices.

The illustrative embodiments are described with respect to certain typesof devices, contacts, layers, planes, structures, materials, dimensions,numerosity, data processing systems, environments, components, andapplications only as examples. Any specific manifestations of these andother similar artifacts are not intended to be limiting to theinvention. Any suitable manifestation of these and other similarartifacts can be selected within the scope of the illustrativeembodiments.

The examples in this disclosure are used only for the clarity of thedescription and are not limiting to the illustrative embodiments.Additional data, operations, actions, tasks, activities, andmanipulations will be conceivable from this disclosure and the same arecontemplated within the scope of the illustrative embodiments.

Any advantages listed herein are only examples and are not intended tobe limiting to the illustrative embodiments. Additional or differentadvantages may be realized by specific illustrative embodiments.Furthermore, a particular illustrative embodiment may have some, all, ornone of the advantages listed above.

With reference to FIG. 1, FIG. 1 illustrates a simplified illustrationof example operating principles of a feedback FET. A feedback FETincludes a substrate, an intrinsic channel on the substrate, a dopedn-type (n+) source in contact with the intrinsic channel, a doped p-type(p+) drain in contact with the intrinsic channel, a first gate (GATE 1)located on top of the channel and overlapping both the intrinsic channelregion and the p-type (p+) drain region, and a second gate (GATE 2)located on top of the channel and overlapping both the intrinsic channelregion and the n-type (n+) source region. In an OFF state 102, apositive gate voltage V_(Gp) and a negative gate voltage V_(Gn) areapplied to Gate 1 and Gate 2, respectively. The energy band structure ofthe feedback FET of FIG. 1 is similar to a band diagram of a p-n-p-ndiode. Potential barriers in the intrinsic channel region are highenough to block the injection of electrons (or holes) from the source(or the drain) to the channel. As a result, the feedback FET deviceremains in the OFF state, even when a low drain-to-source voltage,Y_(DS), is applied.

In an initiation state 104 in which the feedback loop mechanism beginsto initiate, increasing Y_(DS) reduces the energy level of the p+ drain.As a result, some holes flow toward the n+ source and others fall andaccumulate in the potential well generated by V_(Gn) (GATE 2). Theaccumulation of holes in the potential well of GATE 2 reduces theeffective height of the potential barrier seen by the electrons on thesource side, thereby allowing electrons from the n+ source to flowtoward the intrinsic channel region.

In an enabled state 106 in which the positive feedback loop enablessub-kT/q sub-threshold slope, similarly, electrons start to flow towardthe p+ drain across the intrinsic channel region and others fall andaccumulate in the potential well generated by V_(Gp) (GATE 1). Theaccumulation of electrons in the potential well of GATE 2 reduces theeffective height of the potential barrier seen by the holes on the drainside, thereby allowing more holes from the p+ drain to flow toward theintrinsic channel region. As charge carriers are further injected, thecharge carriers continue to accumulate in the potential wells of GATE 1and GATE 2 resulting in the height of potential barriers being loweredexponentially. A positive feedback loop is produced as a result of therecursive and mutual interaction between the potential barriers andcharge carriers. The positive feedback loop eliminates the potentialbarriers and triggers an abrupt increase in the diode current in thefeedback FET.

With reference to FIG. 2, FIG. 2 illustrates a simplified illustrationof example operating principles of the feedback FET of FIG. 1 in n-FETand p-FET operating configurations. In the nFET operation modeconfiguration, V_(Gp) for Gate 1 is fixed to a positive bias and V_(Gn)for Gate 2 is modulated. In the p-channel operation mode configuration,V_(Gn) for Gate 2 is fixed to a negative bias and V_(Gp) for Gate 1 ismodulated.

With reference to FIGS. 3-16, these figures depict an example processfor fabricating a vertical field effect transistor (VFET) with dual-gatefeedback loop mechanism (FB-VFET) in accordance with an embodiment. Inthe embodiment illustrated in FIGS. 8-13, a fabrication system (notshown) fabricates a VFET with dual-gate feedback loop using a gate firstprocess.

With reference to FIG. 3, this figure depicts a portion of the processin which a semiconductor structure 300 is received. The semiconductorstructure includes a silicon (Si) substrate 302.

With reference to FIG. 4, this figure depicts another portion of theprocess in which a structure 400 is formed. FIG. 4 shows a first crosssection view AA′ along a first cross section of structure 400 and asecond cross section view BB′ along a second cross section of structure400. Structure 400 includes substrate 302 having a shallow trenchisolation (STI) layer 304 disposed upon substrate 302. Structure 400further includes a bottom source/drain (S/D) 305 disposed upon substrate302. In one or more embodiments, bottom S/D 305 is formed of an n-type(n+) semiconductor material. Structure 400 further includes a bottomspacer 306 disposed upon a portion of STI 304 and bottom S/D 305.Structure 400 further includes a fin 308 disposed vertically upon aportion of bottom S/D 305 and a hard mask 310 disposed upon a top of fin308. In particular embodiments, STI layer 304, bottom S/D 305, bottomspacer 306, fin 308, and hard mask 310 are formed using conventionalprocesses that are well-known in the art.

With reference to FIG. 5, this figure depicts another portion of theprocess in which a structure 500 is formed. FIG. 5 shows a first crosssection view AA′ along a first cross section of structure 500 and asecond cross section view BB′ along a second cross section of structure500. In the embodiment of FIG. 5, the fabrication system deposits aconformal gate material upon bottom spacer 306 and portions of fin 308and recesses a portion of the gate material upon fin 308 to form a firstgate 312. In a particular embodiment, the gate stack (HKMG) includes anInterlayer Oxide (IL), a gate oxide with high dielectric constant(High-K material such as HfO2) and one or several layers of workfunction metals (such as TiN, TiC, . . . ).

With reference to FIG. 6, this figure depicts another portion of theprocess in which a structure 600 is formed. FIG. 6 shows a first crosssection view AA′ along a first cross section of structure 600 and asecond cross section view BB′ along a second cross section of structure600. In the embodiment of FIG. 6, the fabrication system deposits asacrificial spacer 314 upon first gate 312, fin 308, and hard mask 310.In a particular embodiment, sacrificial spacer 314 is formed of asilicon nitride (SiN) material.

With reference to FIG. 7, this figure depicts another portion of theprocess in which a structure 700 is formed. FIG. 7 shows a first crosssection view AA′ along a first cross section of structure 700 and asecond cross section view BB′ along a second cross section of structure700. In the embodiment of FIG. 7, the fabrication system recessessacrificial spacer 314 to remove portions of sacrificial spacer 314 fromfirst gate 312 and hard mask 310 while leaving portions of sacrificialspacer 314 upon portions of first gate 312 and fin 308. In theembodiment, the fabrication system further applies a photoresist 316 toa portion of sacrificial spacer 314 and performs lithographic patterningon portions of first gate 312. In the embodiment, the fabrication systemfurther recesses the sacrificial spacer 314 and the first gate 312 toremove portions of first gate 312 from bottom spacer 306.

With reference to FIG. 8, this figure depicts another portion of theprocess in which a structure 800 is formed. FIG. 8 shows a first crosssection view AA′ along a first cross section of structure 800 and asecond cross section view BB′ along a second cross section of structure800. In the embodiment of FIG. 8, the fabrication system stripsphotoresist 316 and fills recesses of structure 800 with a firstinter-layer dielectric (ILD) 318 to a top surface of hard mask 310. Inat least one embodiment, first ILD layer 318 is formed of silicondioxide (SiO₂). In the particular embodiment, the fabrication systemfurther performs a chemical mechanical planarization (CMP) process toplanarize the surface of structure 800.

With reference to FIG. 9, this figure depicts another portion of theprocess in which a structure 900 is formed. FIG. 9 shows a first crosssection view AA′ along a first cross section of structure 900 and asecond cross section view BB′ along a second cross section of structure900. In the embodiment of FIG. 9, the fabrication system forms a gatespacer recess 320 within sacrificial spacer 314 and first ILD 318 toexpose portions of fin 308 and hard mask 310.

With reference to FIG. 10, this figure depicts another portion of theprocess in which a structure 1000 is formed. FIG. 10 shows a first crosssection view AA′ along a first cross section of structure 1000 and asecond cross section view BB′ along a second cross section of structure1000. In the embodiment of FIG. 10, the fabrication system deposits aconformal gate material upon a top surface of first ILD 318 andsacrificial spacer 314 and recesses a portion of the gate material uponfin 308 to form a second gate 322. In a particular embodiment, the gatestack (HKMG) includes an Interlayer Oxide (IL), a gate oxide with highdielectric constant (High-K material such as HfO2) and one or severallayers of work function metals (such as TiN, TiC, . . . ).

With reference to FIG. 11, this figure depicts another portion of theprocess in which a structure 1100 is formed. FIG. 11 shows a first crosssection view AA′ along a first cross section of structure 1100 and asecond cross section view BB′ along a second cross section of structure1100. In the embodiment of FIG. 11, the fabrication system deposits atop spacer 324 around portions of second gate 322, fin 308, and hardmask 310. In the embodiment, the fabrication system further applies aphotoresist 326 to a portion of second gate 322 and performslithographic patterning on portions of second gate 322. In theembodiment, the fabrication system further recesses second gate 322 toremove portions of second gate 322 from first ILD 318.

With reference to FIG. 12, this figure depicts another portion of theprocess in which a structure 1200 is formed. FIG. 12 shows a first crosssection view AA′ along a first cross section of structure 1200 and asecond cross section view BB′ along a second cross section of structure1200. In the embodiment of FIG. 12, the fabrication system stripsphotoresist 326 and refills recesses of structure 1200 with a secondinter-layer dielectric (ILD) 328 to the top surface of hard mask 310. Inthe particular embodiment, the fabrication system further performs achemical mechanical planarization (CMP) process to planarize the surfaceof structure 1200.

With reference to FIG. 13, this figure depicts another portion of theprocess in which a structure 1300 is formed. FIG. 13 shows a first crosssection view AA′ along a first cross section of structure 1300 and asecond cross section view BB′ along a second cross section of structure1300. In the embodiment of FIG. 13, the fabrication system recessesportions of top spacer 324 and etches back hard mask 310 to form a topS/D recess 330.

With reference to FIG. 14, this figure depicts another portion of theprocess in which a structure 1400 is formed. FIG. 14 shows a first crosssection view AA′ along a first cross section of structure 1400 and asecond cross section view BB′ along a second cross section of structure1400. In the embodiment of FIG. 14, the fabrication system forms a topsource/drain (S/D) 332 within top spacer recess 330. In one or moreembodiments, top S/D 332 is formed using a epitaxy process. In one ormore embodiments, top S/D 332 is formed of a p-type (p+) semiconductormaterial.

With reference to FIG. 15, this figure depicts another portion of theprocess in which a structure 1500 is formed. FIG. 15 shows a first crosssection view AA′ along a first cross section of structure 1500 and asecond cross section view BB′ along a second cross section of structure1500. In the embodiment of FIG. 15, the fabrication system forms a firstgate contact 334, a second gate contact 336, a top S/D contact 338, anda bottom S/D contact 340 within second ILD 328. First gate contact 334is formed in contact with first gate 312 and extends to a top surface ofsecond ILD 328. Second gate contact 336 is formed in contact with secondgate 322 and extends to the top surface of second ILD 328. Top S/Dcontact 338 is formed in contact with top S/D 332 and extends to the topsurface of second ILD 328, and bottom S/D contact 340 is formed incontact with bottom S/D 305 and extends to the top surface of second ILD328. Accordingly, a VFET with dual-gate feedback loop is fabricated inaccordance with an embodiment.

With reference to FIG. 16, this figure depicts a top view 1600 of theVFET with dual-gate feedback loop of FIG. 15. FIG. 16 furtherillustrates in a top view the first cross-section AA′ line and secondcross-section BB′ line of FIG. 15.

With reference to FIG. 17, this figure depicts a flowchart of an exampleprocess 1700 for fabricating a VFET with dual-gate feedback loop inaccordance with an illustrative embodiment. In block 1702, thefabrication system receives a substrate structure including substrate302. In block 1703A, the fabrication system forms fin 308 disposedvertically upon a portion of substrate 302 and hard mask 310 disposedupon a top of fin 308. In block 1703B, the fabrication system formsbottom S/D 305 upon substrate 302. In one or more embodiments, bottomS/D 305 is formed of a n-type (n+) material. In block 1703C, thefabrication system forms shallow trench isolation (STI) layer 304 uponsubstrate 302.

In block 1704, the fabrication system forms bottom spacer 306 upon aportion of STI 304 and bottom S/D 305. In block 1706, the fabricationsystem forms first gate 312 upon bottom spacer 306. In a particularembodiment, the fabrication system forms first gate 312 by depositing aconformal gate material upon bottom spacer 306 and portions of fin 308and recessing a portion of the gate material upon fin 308 to form afirst gate 312. In a particular embodiment, the gate stack (HKMG)includes an Interlayer Oxide (IL), a gate oxide with high dielectricconstant (High-K material such as HfO2) and one or several layers ofwork function metals (such as TiN, TiC, . . . ).

In block 1708, the fabrication system deposits sacrificial spacer 314upon first gate 312, fin 308, and hard mask 310. In a particularembodiment, sacrificial spacer 314 is formed of a silicon nitride (SiN)material. In block 1710, fabrication system recesses sacrificial spacer314 to remove portions of sacrificial spacer 314 from first gate 312 andhard mask 310 while leaving portions of sacrificial spacer 314 uponportions of first gate 312 and fin 308. In block 1712, the fabricationsystem further applies photoresist 316 to a portion of first gate 312and performs lithographic patterning on portions of first gate 312. Inblock 1714, the fabrication system further recesses first gate 312 toremove portions of first gate 312 from bottom spacer 306.

In block 1716, the fabrication system strips photoresist 316. In block1718, the fabrication system fills recesses of the structure with firstinter-layer dielectric (ILD) 318 to a top surface of hard mask 310. Inthe particular embodiment, the fabrication system further performs achemical mechanical planarization (CMP) process to planarize the surfaceof the structure.

In block 1720, the fabrication system forms a gate spacer recess 320within sacrificial spacer 314 and first ILD 318 to expose portions offin 308 and hard mask 310 to form a gate spacer on the first gate fromsacrificial spacer 314. In block 1722, the fabrication system formssecond gate 3322 by depositing a conformal gate material upon a topsurface of first ILD 318 and sacrificial spacer 314 and recesses aportion of the gate material upon fin 308 to form a second gate 322. Ina particular embodiment, the typical gate stack (HKMG) includes anInterlayer Oxide (IL), a gate oxide with high dielectric constant(High-K material such as HfO2) and one or several layers of workfunction metals (such as TiN, TiC, . . . ).

In block 1724, the fabrication system deposits top spacer 324 aroundportions of second gate 322, fin 308, and hard mask 310. In block 1726,the fabrication system further applies a photoresist 326 to a portion ofsecond gate 322 and performs lithographic patterning on portions ofsecond gate 322. In block 1728, the fabrication system further recessessecond gate 322 to remove portions of second gate 322 from first ILD318.

In block 1730, the fabrication system strips photoresist 326. In block1732, the fabrication system refills recesses of the structure withsecond inter-layer dielectric (ILD) 328 to the top surface of hard mask310. In the particular embodiment, the fabrication system furtherperforms a chemical mechanical planarization (CMP) process to planarizethe surface of the structure.

In block 1734, the fabrication system recesses hard mask 310 andportions of top spacer 324 to form top spacer recess 330. In 1738, thefabrication system forms top S/D 332 within top spacer recess 330. Inone or more embodiments, top S/D 332 is formed using a epitaxy process.In one or more embodiments, top S/D 332 is formed of a p-type (p+)material.

In block 1740, the fabrication system forms first gate contact 334,second gate contact 336, top S/D contact 338, and bottom S/D contact 340within second ILD 328. First gate contact 334 is formed in contact withfirst gate 312 and extends to a top surface of second ILD 328. Secondgate contact 336 is formed in contact with second gate 322 and extendsto the top surface of second ILD 328. Top S/D contact 338 is formed incontact with top S/D 332 and extends to the top surface of second ILD328, and bottom S/D contact 340 is formed in contact with bottom S/D 305and extends to the top surface of second ILD 328. The process then ends.Accordingly, a VFET with dual-gate feedback loop is fabricated by theprocess in accordance with an embodiment.

With reference to FIGS. 18-33, these figure depict another exampleprocess for fabricating a vertical field effect transistor (VFET) withdual-gate feedback loop mechanism in accordance with an embodiment. Inthe embodiment illustrated in FIGS. 18-33, a fabrication system (notshown) fabricates a VFET with dual-gate feedback loop using a gate lastprocess.

With reference to FIG. 18, this figure depicts a portion of the processin which a semiconductor structure 1800 is received. The semiconductorstructure includes a silicon (Si) substrate 1802.

With reference to FIG. 19, this figure depicts a portion of the processin which a structure 1900 is formed. FIG. 19 shows a first cross sectionview AA′ along a first cross section of structure 1900 and a secondcross section view BB′ along a second cross section of structure 1900.Structure 1900 includes substrate 1802 having a shallow trench isolation(STI) layer 1804 disposed upon substrate 1802. Structure 1900 furtherincludes a bottom source/drain (S/D) 1805 disposed upon substrate 1802.In one or more embodiments, bottom S/D 1805 is formed of a n-type (n+)material. Structure 1900 further includes a bottom spacer 1806 disposedupon a portion of STI 1804 and bottom S/D 1805. Structure 1900 furtherincludes a fin 1808 disposed vertically upon a portion of bottom S/D1805 and a hard mask 1810 disposed upon a top of fin 1808. In particularembodiments, STI layer 1804, bottom S/D 1805, bottom spacer 1806, fin1808, and hard mask 1810 are formed using conventional processes thatare well-known in the art.

With reference to FIG. 20, this figure depicts a portion of the processin which a structure 2000 is formed. FIG. 20 shows a first cross sectionview AA′ along a first cross section of structure 2000 and a secondcross section view BB′ along a second cross section of structure 2000.In the embodiment of FIG. 20, the fabrication system deposits a firstILD layer 1812 upon bottom spacer 1806, and a gate spacer layer 1814upon first ILD layer 1812. The fabrication system further deposits asecond ILD layer 1816 upon gate spacer layer 1814, and a top spacerlayer 1820 upon second ILD layer 1816. In at least one embodiment, firstILD layer 1812 and second ILD layer 1816 is formed of silicon dioxide(SiO₂). In at least one embodiment, bottom spacer 1806, gate spacerlayer 1814, and top spacer layer 1820 are formed of a low dielectricconstant (low-K) material. In particular embodiments, one or more ofbottom spacer 1806, first ILD layer 1812, gate spacer layer 1814, secondILD layer 1816, and top spacer 1820 are formed using an anisotropicdeposition process.

With reference to FIG. 21, this figure depicts a portion of the processin which a structure 2100 is formed. FIG. 21 shows a first cross sectionview AA′ along a first cross section of structure 2100 and a secondcross section view BB′ along a second cross section of structure 2100.In the embodiment of FIG. 21, the fabrication system deposits aconformal low-K dielectric material and performs an etching process onthe low-K dielectric material to form a sidewall spacer (main spacer)1822 upon top spacer 1820 around an upper portion of fin 1808 and hardmask 1810. In a particular embodiment, the etching process is areactive-ion etching (RIE) process.

With reference to FIG. 22, this figure depicts a portion of the processin which a structure 2200 is formed. FIG. 22 shows a first cross sectionview AA′ along a first cross section of structure 2200 and a secondcross section view BB′ along a second cross section of structure 2200.In the embodiment of FIG. 22, the fabrication system selectively removesthe second ILD layer 1816 using an isotropic etch back process leavinggate spacer 1814 disposed along fin 1808.

With reference to FIG. 23, this figure depicts a portion of the processin which a structure 2300 is formed. FIG. 23 shows a first cross sectionview AA′ along a first cross section of structure 2300 and a secondcross section view BB′ along a second cross section of structure 2300.In the embodiment of FIG. 23, the fabrication system deposits a gatematerial 1826 upon bottom spacer 1806, fin 1808, gate spacer 1814, topspacer 1820, sidewall spacer 1822, and hard mask 1810. In particularembodiments, gate material 1826 includes an Interlayer Oxide (IL), agate oxide with high dielectric constant (High-K material such as HfO2)and one or several layers of work function metals (such as TiN, TiC, . .. ).

With reference to FIG. 24, this figure depicts a portion of the processin which a structure 2400 is formed. FIG. 24 shows a first cross sectionview AA′ along a first cross section of structure 2400 and a secondcross section view BB′ along a second cross section of structure 2400.In the embodiment of FIG. 24, the fabrication system forms a first gate1828 between bottom spacer 1806 and gate spacer 1814, and a second gate1830 between gate spacer 1814 and top spacer 1820 by removing portionsof gate material 1826. In a particular embodiment, the fabricationsystem removes portions of gate material 1826 using an anisotropic RIEprocess.

With reference to FIG. 25, this figure depicts a portion of the processin which a structure 2500 is formed. FIG. 25 shows a first cross sectionview AA′ along a first cross section of structure 2500 and a secondcross section view BB′ along a second cross section of structure 2500.In the embodiment of FIG. 25, the fabrication system deposits first ILDlayer 1812 upon bottom spacer 1814 and a portion of first gate 1828. Inthe embodiment, the fabrication system further conformally deposits afirst tungsten (W) contact material 1832 on first ILD layer 1812, aportion of first gate 1828, gate spacer 1814, second gate 1830, topspacer 1820, and sidewall spacer 1822.

With reference to FIG. 26, this figure depicts a portion of the processin which a structure 2600 is formed. FIG. 26 shows a first cross sectionview AA′ along a first cross section of structure 2600 and a secondcross section view BB′ along a second cross section of structure 2600.In the embodiment of FIG. 26, the fabrication system deposits second ILDmaterial 1834 upon a lower portion of first tungsten (W) contactmaterial 1832. In a particular embodiment, ILD material 1834 is formedof SiO₂.

With reference to FIG. 26A, this figure depicts a portion of the processin which a structure 2650 is formed. FIG. 26A shows a first crosssection view AA′ along a first cross section of structure 2650 and asecond cross section view BB′ along a second cross section of structure2650. In the embodiment of FIG. 26A, the fabrication system etches firsttungsten (W) contact material 1832 to substantially remove firsttungsten (W) contact material 1832 from gate spacer 1814, second gate1830, top spacer 1820, and sidewall spacer 1822.

With reference to FIG. 27, this figure depicts a portion of the processin which a structure 2700 is formed. FIG. 27 shows a first cross sectionview AA′ along a first cross section of structure 2700 and a secondcross section view BB′ along a second cross section of structure 2700.In the embodiment of FIG. 27, the fabrication system deposits aphotoresist 1836 on top surface of tungsten (W) contact material 1832, aportion of first gate 1828, gate spacer 1814, second gate 1830, topspacer 1820, and sidewall spacer 1822 and performs lithographicpatterning on first tungsten contact material 1832.

With reference to FIG. 27A, this figure depicts a portion of the processin which a structure 2725 is formed. FIG. 27A shows a first crosssection view AA′ along a first cross section of structure 2725 and asecond cross section view BB′ along a second cross section of structure2725. In the embodiment of FIG. 27A, the fabrication system deposits asecond tungsten contact material 1838 in contact with second gate 1830.

With reference to FIG. 27B, this figure depicts a portion of the processin which a structure 2750 is formed. FIG. 27B shows a first crosssection view AA′ along a first cross section of structure 2750 and asecond cross section view BB′ along a second cross section of structure2750. In the embodiment of FIG. 27B, the fabrication system depositsadditional first ILD 1812 upon a portion of second tungsten contactmaterial 1838.

With reference to FIG. 27C, this figure depicts a portion of the processin which a structure 2775 is formed. FIG. 27C shows a first crosssection view AA′ along a first cross section of structure 2775 and asecond cross section view BB′ along a second cross section of structure2775. In the embodiment of FIG. 27C, the fabrication system etchessecond tungsten contact material 1838 to remove a portion of secondtungsten contact material 1838 from second gate 1830, top spacer 1820,and sidewall spacer 1822.

With reference to FIG. 28, this figure depicts a portion of the processin which a structure 2800 is formed. FIG. 28 shows a first cross sectionview AA′ along a first cross section of structure 2800 and a secondcross section view BB′ along a second cross section of structure 2800.In the embodiment of FIG. 28, the fabrication system further performslithographic patterning on second tungsten contact material 1838.

With reference to FIG. 29, this figure depicts a portion of the processin which a structure 2900 is formed. FIG. 29 shows a first cross sectionview AA′ along a first cross section of structure 2900 and a secondcross section view BB′ along a second cross section of structure 2900.In the embodiment of FIG. 29, the fabrication system deposits a thirdinter-layer dielectric (ILD) 1840 to fill recesses of structure 2900with third ILD 1840 to a top surface of hard mask 1810. In at least oneembodiment, third ILD layer 1840 is formed of silicon dioxide (SiO₂). Inthe particular embodiment, the fabrication system further performs achemical mechanical planarization (CMP) process to planarize the surfaceof structure 2900.

With reference to FIG. 30, this figure depicts a portion of the processin which a structure 3000 is formed. FIG. 30 shows a first cross sectionview AA′ along a first cross section of structure 3000 and a secondcross section view BB′ along a second cross section of structure 3000.In the embodiment of FIG. 30, the fabrication system etches back hardmask 1810 and recesses sidewall spacer 1822 selectively to the topspacer 1820 to form a top S/D recess 1842.

With reference to FIG. 31, this figure depicts a portion of the processin which a structure 3100 is formed. FIG. 31 shows a first cross sectionview AA′ along a first cross section of structure 3100 and a secondcross section view BB′ along a second cross section of structure 3100.In the embodiment of FIG. 31, the fabrication system forms a topsource/drain (S/D) 1844 within top spacer recess 1842. In one or moreembodiments, top S/D 1844 is formed using a epitaxy process. In one ormore embodiments, top S/D 1844 is formed of a p-type (p+) material.

With reference to FIG. 32, this figure depicts a portion of the processin which a structure 3200 is formed. FIG. 32 shows a first cross sectionview AA′ along a first cross section of structure 3200 and a secondcross section view BB′ along a second cross section of structure 3200.In the embodiment of FIG. 32, the fabrication system forms a first gatecontact 1846, a second gate contact 1848, a bottom S/D contact 1850, anda top S/D contact 1852 within ILD 1840. First gate contact 1846 isformed in contact with first tungsten contact material 1832 and extendsto a top surface of ILD 1840. Second gate contact 1858 is formed incontact with second tungsten contact material 1838 and extends to thetop surface of ILD 1840. Bottom S/D contact 1850 is formed in contactwith bottom S/D 1805 and extends to the top surface of ILD 1840, and topS/D contact 1852 is formed in contact with top S/D 1844 and extends tothe top surface of ILD 1840. Accordingly, a VFET with dual-gate feedbackloop is fabricated in accordance with an embodiment.

With reference to FIG. 33, this figure depicts a top view 3300 of theVFET with dual-gate feedback loop of FIG. 32. FIG. 33 furtherillustrates in a top view the first cross-section AA′ line and secondcross-section BB′ line of FIG. 32.

With reference to FIG. 34, this figure depicts a flowchart of anotherexample process 3400 for fabricating a VFET with dual-gate feedback loopin accordance with another illustrative embodiment. In block 3402, thefabrication system receives a semiconductor structure including asubstrate 1802. In block 3403A, the fabrication system forms fin 1808disposed vertically upon a portion of substrate 1802 and hard mask 1810disposed upon a top of fin 1808. In block 3403B, the fabrication systemforms bottom source/drain (S/D) 1805 upon substrate 1802. In one or moreembodiments, bottom S/D 1805 is formed of a n-type (n+) material. Inblock 3403C, the fabrication system forms shallow trench isolation (STI)layer 1804 upon substrate 1802. In particular embodiments, STI layer1804, bottom S/D 1805, fin 1808, and hard mask 1810 are formed usingconventional processes that are well-known in the art. In block 3404,the fabrication system forms bottom spacer 1806 disposed upon a portionof STI 1804 and bottom S/D 1805.

In block 3406, the fabrication system deposits first ILD layer 1812 uponbottom spacer 1806. In block 3408, the fabrication system forms gatespacer layer 1814 upon first ILD layer 1812. In block 3410, thefabrication system deposits second ILD layer 1816 upon gate spacer layer1814. In block 3412, the fabrication system forms top spacer layer 1820upon second ILD layer 1816. In at least one embodiment, first ILD layer1812 and second ILD layer 1816 is formed of silicon dioxide (SiO₂). Inat least one embodiment, bottom spacer 1806, gate spacer layer 1814, andtop spacer layer 1820 are formed of a low dielectric constant (low-K)material. In particular embodiments, one or more of bottom spacer 1806,first ILD layer 1812, gate spacer layer 1814, second ILD layer 1816, andtop spacer 1820 are formed using an anisotropic deposition process.

In block 3414, the fabrication system forms sidewall spacer 1822 upontop spacer 1820 around an upper portion of fin 1808 and hard mask 1810by depositing a conformal low-K dielectric material and performing anetching process on the low-K dielectric material. In a particularembodiment, the etching process is a reactive-ion etching (RIE) process.In block 3416, the fabrication system etches gate spacer 1814 and secondILD layer 1816. In block 3416, the fabrication system selectivelyremoves the second ILD layer 1816 using an isotropic etch back processleaving gate spacer 1814 disposed along fin 1808.

In block 3420, the fabrication system deposits gate material 1826 uponbottom spacer 1806, fin 1808, gate spacer 1814, top spacer 1820,sidewall spacer 1822, and hard mask 1810. In particular embodiments,gate material 1826 includes an Interlayer Oxide (IL), a gate oxide withhigh dielectric constant (High-K material such as HfO2) and one orseveral layers of work function metals (such as TiN, TiC, . . . ). Inblock 3422, the fabrication system performs anistropic etch back to formfirst gate 1828 between bottom spacer 1806 and gate spacer 1814, andsecond gate 1830 between gate spacer 1814 and top spacer 1820 byremoving portions of gate material 1826. In a particular embodiment, thefabrication system removes portions of gate material 1826 using ananisotropic RIE process.

In block 3424, the fabrication system further conformally deposits firsttungsten (W) contact material 1832 on first ILD layer 1812, a portion offirst gate 1828, gate spacer 1814, second gate 1830, top spacer 1820,and sidewall spacer 1822. In block 3426, the fabrication system depositssecond ILD material 1834 upon a lower portion of first tungsten (W)contact material 1832. In a particular embodiment, ILD material 1834 isformed of SiO₂. In block 3426A, the fabrication system performsconformal etch back of first tungsten (W) contact material 1832.

In block 3428, the fabrication system deposits a photoresist 1836 on atop surface of tungsten (W) contact material 1832, a portion of firstgate 1828, gate spacer 1814, second gate 1830, top spacer 1820, andsidewall spacer 1822. The fabrication system performs lithographicpatterning on first tungsten contact material 1832. In block 3430, thefabrication system deposits second tungsten contact material 1838 incontact with second gate 1830 upon first ILD 1812. In block 3430A, thefabrication system deposits additional ILD 1812. In block 3430B, thefabrication system performs conformal etch back of first tungsten (W)contact material 1832. In block 3432, the fabrication system furtherperforms lithographic patterning on second tungsten contact material1838. In block 3434, the fabrication system recesses ILD 1812 and secondtungsten contact material 1838 to remove a portion of second tungstencontact material 1838 from ILD 1812.

In block 3436, the fabrication system deposits third inter-layerdielectric (ILD) 1840 to fill recesses of structure 2900 with third ILD1840 to a top surface of hard mask 1810. In at least one embodiment,third ILD layer 1840 is formed of silicon dioxide (SiO₂). In theparticular embodiment, the fabrication system further performs achemical mechanical planarization (CMP) process to planarize the surfaceof the structure.

In block 3438, the fabrication system recesses hard mask 1810 andsidewall spacer (main spacer) 1822 to form a top spacer recess 1842. Inblock 3440, the fabrication system forms a top source/drain (S/D) 1844within top spacer recess 1842. In one or more embodiments, top S/D 1844is formed using a epitaxy process. In one or more embodiments, top S/D1844 is formed of a p-type (p+) material. In block 3442, the fabricationsystem forms first gate contact 1846, second gate contact 1848, bottomS/D contact 1850, and top S/D contact 1852 within ILD 1840. First gatecontact 1846 is formed in contact with first tungsten contact material1832 and extends to a top surface of ILD 1840. Second gate contact 336is formed in contact with second tungsten contact material 1838 andextends to the top surface of ILD 1840. Bottom S/D contact 1850 isformed in contact with bottom S/D 1805 and extends to the top surface ofILD 1840, and top S/D contact 1852 is formed in contact with top S/D1844 and extends to the top surface of ILD 1840. The process then ends.Accordingly, a VFET with dual-gate feedback loop is fabricated by theprocess in accordance with another embodiment.

With reference to FIGS. 35-48, these figure depict another exampleprocess for fabricating a vertical field effect transistor (VFET) withdual-gate feedback loop mechanism in accordance with an embodiment. Inthe embodiment illustrated in FIGS. 35-48, a fabrication system (notshown) fabricates a VFET with dual-gate feedback loop using areplacement fin and gate last integration process.

With reference to FIG. 35, this figure depicts a portion of the processin which a semiconductor structure 3500 is received. The semiconductorstructure includes a silicon (Si) substrate 3502.

With reference to FIG. 36, this figure depicts a portion of the processin which a structure 3600 is formed. FIG. 36 shows a first cross sectionview AA′ along a first cross section of structure 3600 and a secondcross section view BB′ along a second cross section of structure 3600.Structure 3600 includes substrate 3502 having a shallow trench isolation(STI) layer 3504 disposed upon substrate 3502. Structure 3600 furtherincludes a bottom source/drain (S/D) 3505 disposed upon substrate 3502.In one or more embodiments, bottom S/D 3505 is formed of a n-type (n+)material. Structure 3600 further includes a bottom spacer 3506 disposedupon a portion of STI 1804 and bottom S/D 1805. In particularembodiments, STI layer 1804, bottom S/D 1805, and bottom spacer 1806 areformed using conventional processes that are well-known in the art. Inthe embodiment of FIG. 36, the fabrication system deposits a first ILDlayer 3508 upon bottom spacer 3506, and a gate spacer layer 3510 uponfirst ILD layer 3508. The fabrication system further deposits a secondILD layer 3512 upon gate spacer layer 3510, and a top spacer layer 3514upon second ILD layer 3512. The fabrication system further deposits athird ILD layer 3516 upon top spacer layer 3514. In at least oneembodiment, first ILD layer 3508, second ILD layer 3512, and third ILDlayer 3516 are formed of silicon dioxide (SiO₂). In at least oneembodiment, bottom spacer 3506, gate spacer layer 3510, and top spacerlayer 3514 are formed of a low dielectric constant (low-K) material. Inparticular embodiments, one or more of bottom spacer 3506, first ILDlayer 3508, gate spacer layer 3510, second ILD layer 3512, top spacer3514, and third ILD layer 3516 are formed using an anisotropicdeposition process.

With reference to FIG. 37, this figure depicts a portion of the processin which a structure 3700 is formed. FIG. 37 shows a first cross sectionview AA′ along a first cross section of structure 3700 and a secondcross section view BB′ along a second cross section of structure 3700.In the embodiment of FIG. 37, the fabrication system forms a fin trench3518 through third ILD layer 3516, top spacer 3514, second ILD layer3512, gate spacer 3510, first ILD 3508, bottom spacer 3506 to a topsurface of bottom S/D 3505.

With reference to FIG. 38, this figure depicts a portion of the processin which a structure 3800 is formed. FIG. 38 shows a first cross sectionview AA′ along a first cross section of structure 3800 and a secondcross section view BB′ along a second cross section of structure 3800.In the embodiment of FIG. 38, the fabrication system forms a fin 3520within fin trench 3518 from the top surface of bottom S/D 3505 toapproximately a top surface of top spacer 3514.

With reference to FIG. 39, this figure depicts a portion of the processin which a structure 3900 is formed. FIG. 39 shows a first cross sectionview AA′ along a first cross section of structure 3900 and a secondcross section view BB′ along a second cross section of structure 3900.In the embodiment of FIG. 39, the fabrication system forms a topsource/drain (S/D) 3522 upon fin 3520 within fin trench 3518. In one ormore embodiments, top S/D 1844 is formed using a epitaxy process. In oneor more embodiments, top S/D 1844 is formed of a p-type (p+) material.In the embodiment, the fabrication system forms a hard mask 3524 upon atop surface of top S/D 3522 within fin trench 3518 to a top surface ofthird ILD layer 3516.

With reference to FIG. 40, this figure depicts a portion of the processin which a structure 4000 is formed. FIG. 40 shows a first cross sectionview AA′ along a first cross section of structure 4000 and a secondcross section view BB′ along a second cross section of structure 4000.In the embodiment of FIG. 40, the fabrication system removes third ILDlayer 3516, performs conformal deposition of main spacer material 3528on spacer layer 3514, top S/D contract 3522, and hard mask 3524. Thefabrication system further performs an anisotropic RIE of spacer layer3514 and main spacer material 3528 to form top spacer 3526 and sidewallspacer (main spacer) 3528, respectively.

With reference to FIG. 41, this figure depicts a portion of the processin which a structure 4100 is formed. FIG. 41 shows a first cross sectionview AA′ along a first cross section of structure 4100 and a secondcross section view BB′ along a second cross section of structure 4100.In the embodiment of FIG. 41, the fabrication system etches portions ofsecond ILD layer 3512, gate spacer layer 3510, and first ILD layer 3508down to the upper surface of bottom spacer 3506 to form a dummy gate. Inthe embodiment of FIG. 41, portions of first ILD layer 3508 disposedbetween bottom spacer 3506 and gate spacer 3510 remain, and portions ofsecond ILD layer 3512 disposed between gate spacer 3510 and top spacer3514 remain. In particular embodiments, the fabrication system etchesportions of second ILD layer 3512, gate spacer layer 3510, and first ILDlayer 3508 using an RIE process.

With reference to FIG. 42, this figure depicts a portion of the processin which a structure 4200 is formed. FIG. 42 shows a first cross sectionview AA′ along a first cross section of structure 4200 and a secondcross section view BB′ along a second cross section of structure 4200.In the embodiment of FIG. 42, the fabrication system selectively removesthe dummy gate including the remaining portions of second ILD layer 1816and first ILD layer 3508 leaving gate spacer 3510 disposed along fin3520. In a particular embodiment, the fabrication system removes theremaining portions of second ILD layer 1816 and first ILD layer 3508using an isotropic etch back process.

With reference to FIG. 43, this figure depicts a portion of the processin which a structure 4300 is formed. FIG. 43 shows a first cross sectionview AA′ along a first cross section of structure 4300 and a secondcross section view BB′ along a second cross section of structure 4300.In the embodiment of FIG. 43, the fabrication system deposits a gatematerial 3522 upon bottom spacer 3506, fin 3508, gate spacer 3510, topspacer 3526, sidewall spacer 3528, and hard mask 3524. In a particularembodiment, gate material 1826 includes an Interlayer Oxide (IL), a gateoxide with high dielectric constant (High-K material such as HfO2) andone or several layers of work function metals (such as TiN, TiC, . . .).

With reference to FIG. 44, this figure depicts a portion of the processin which a structure 4400 is formed. FIG. 44 shows a first cross sectionview AA′ along a first cross section of structure 4400 and a secondcross section view BB′ along a second cross section of structure 4400.In the embodiment of FIG. 44, the fabrication system forms a first gate3536 between bottom spacer 3506 and gate spacer 3510, and a second gate3538 between gate spacer 3510 and top spacer 3526 by removing portionsof gate material 3532. In a particular embodiment, the fabricationsystem removes portions of gate material 3532 using an anisotropic RIEprocess. In the embodiment, the fabrication system deposits an organicplanarization layer (OPL) 3534 upon portions of first gate 3536 andsecond gate 3538, and performs lithographic patterning upon first gate3536 and second gate 3538.

With reference to FIG. 45, this figure depicts a portion of the processin which a structure 4500 is formed. FIG. 45 shows a first cross sectionview AA′ along a first cross section of structure 4500 and a secondcross section view BB′ along a second cross section of structure 4500.In the embodiment of FIG. 45, the fabrication system strips OPL 3534 anddeposits dielectric material 3540 upon bottom spacer 3506 and a portionof first gate 3536.

With reference to FIG. 46, this figure depicts a portion of the processin which a structure 4600 is formed. FIG. 46 shows a first cross sectionview AA′ along a first cross section of structure 4600 and a secondcross section view BB′ along a second cross section of structure 4600.In the embodiment of FIG. 46, the fabrication system deposits tungstencontact material 3542 on dielectric material 3540 and a portion ofsecond gate 3538. In the embodiment, the fabrication system furtherapplies an OPL 3544 to tungsten contact material 3542 and second gate3538 and lithographically patterns second gate 3538. The fabricationsystem then removes OPL 3544.

With reference to FIG. 47, this figure depicts a portion of the processin which a structure 4700 is formed. FIG. 47 shows a first cross sectionview AA′ along a first cross section of structure 4700 and a secondcross section view BB′ along a second cross section of structure 4700.In the embodiment of FIG. 47, the fabrication system deposits additionaldielectric material 3540 to fill recesses of structure 4700 to a topsurface of hard mask 3524. In the embodiment, the fabrication systemforms a first gate contact 3546, a second gate contact 3548, a bottomS/D contact 3550, and a top S/D contact 3552 within dielectric material3540. First gate contact 3546 is formed in contact with first gate 3536and extends to a top surface of dielectric material 3540. Second gatecontact 3548 is formed in contact with tungsten contact material 3542and extends to the top surface of dielectric material 3540. Bottom S/Dcontact 3550 is formed in contact with bottom S/D 3505 and extends tothe top surface of dielectric material 3540, and top S/D contact 3552 isformed in contact with top S/D 3522 and extends to the top surface ofdielectric material 3540. Accordingly, a VFET with dual-gate feedbackloop is fabricated in accordance with an embodiment.

With reference to FIG. 48, this figure depicts a top view 4800 of theVFET with dual-gate feedback loop of FIG. 47. FIG. 48 furtherillustrates in a top view the first cross-section AA′ line and secondcross-section BB′ line of FIG. 47.

With reference to FIG. 49, this figure depicts a flowchart of anotherexample process 4900 for fabricating a VFET with dual-gate feedback loopin accordance with another illustrative embodiment. In block 4902, thefabrication system receives a semiconductor structure including asubstrate 3502 and a shallow trench isolation (STI) layer 2504 disposedupon substrate 3502. The structure further includes a bottomsource/drain (S/D) 3505 disposed upon substrate 3502. In one or moreembodiments, bottom S/D 3505 is formed of a n-type (n+) material. Inparticular embodiments, STI layer 3504 and bottom S/D 3505 are formedusing conventional processes that are well-known in the art. In block4904, the fabrication system forms bottom spacer 3506 disposed upon aportion of STI 3504 and bottom S/D 3505.

In block 4906, the fabrication system deposits first ILD layer 3508 uponbottom spacer 3506. In block 4908, the fabrication system forms gatespacer layer 3510 upon first ILD layer 3508. In block 4910, thefabrication system deposits second ILD layer 3512 upon gate spacer layer3510. In block 4912, the fabrication system forms top spacer layer 3514upon second ILD layer 3512. In block 4914, the fabrication systemfurther deposits third ILD layer 3516 upon top spacer layer 3514. In atleast one embodiment, first ILD layer 3508, second ILD layer 3512, andthird ILD layer 3516 are formed of silicon dioxide (SiO₂). In at leastone embodiment, bottom spacer 3506, gate spacer layer 3510, and topspacer layer 3514 are formed of a low dielectric constant (low-K)material. In particular embodiments, one or more of bottom spacer 3506,first ILD layer 3508, gate spacer layer 3510, second ILD layer 3512, topspacer 3514, and third ILD layer 3516 are formed using an anisotropicdeposition process.

In block 4916, the fabrication system forms fin trench 3518 throughthird ILD layer 3516, top spacer 3514, second ILD layer 3512, gatespacer 3510, first ILD 3508, bottom spacer 3506 to a top surface ofbottom S/D 3505. In block 4920, the fabrication system forms fin 3520within fin trench 3518 from the top surface of bottom S/D 3505 toapproximately a top surface of top spacer 3514. In block 4922, thefabrication system forms a top source/drain (S/D) 3522 upon fin 3520within fin trench 3518. In one or more embodiments, top S/D 1844 isformed using a epitaxy process. In one or more embodiments, top S/D 1844is formed of a p-type (p+) material.

In block 4924, the fabrication system forms a hard mask 3524 upon a topsurface of top S/D 3522 within fin trench 3518 to a top surface of thirdILD layer 3516. In block 4926, the fabrication system removes third ILDlayer 3516 and etches spacer layer 3514 to form top spacer 3526. Inblock 4928, the fabrication system forms sidewall spacer 2528 bydepositing a conformal low-K dielectric material and etching the low-Kdielectric material upon top spacer 3526 around an upper portion of fin3520 and hard mask 3524. In a particular embodiment, the etching processis a reactive-ion etching (RIE) process.

In block 4930, the fabrication system portions of second ILD layer 3512,gate spacer layer 3510, and first ILD layer 3508 down to the uppersurface of bottom spacer 3506 to form a dummy stack. In the embodimentportions of first ILD layer 3508 disposed between bottom spacer 3506 andgate spacer 3510 remain, and portions of second ILD layer 3512 disposedbetween gate spacer 3510 and top spacer 3514 remain. In particularembodiments, the fabrication system etches portions of second ILD layer3512, gate spacer layer 3510, and first ILD layer 3508 using an RIEprocess.

In block 4932, the fabrication system selectively removes the dummy gateincluding the remaining portions of second ILD layer 1816 and first ILDlayer 3508 leaving gate spacer 3510 disposed along fin 3520. In aparticular embodiment, the fabrication system removes the remainingportions of second ILD layer 1816 and first ILD layer 3508 using anisotropic etch back process. In block 4934, the fabrication systemdeposits a gate material 3522 upon bottom spacer 3506, fin 3508, gatespacer 3510, top spacer 3526, sidewall spacer 3528, and hard mask 3524.In a particular embodiment, gate material 1826 includes an InterlayerOxide (IL), a gate oxide with high dielectric constant (High-K materialsuch as HfO2) and one or several layers of work function metals (such asTiN, TiC, . . . ).

In block 4936, the fabrication system forms a first gate 3536 betweenbottom spacer 3506 and gate spacer 3510, and a second gate 3538 betweengate spacer 3510 and top spacer 3526 by removing portions of gatematerial 3532. In a particular embodiment, the fabrication systemremoves portions of gate material 3532 using an anisotropic RIE process.In the embodiment, the fabrication system deposits an organicplanarization layer (OPL) 3534 upon portions of first gate 3536 andsecond gate 3538, and performs lithographic patterning upon first gate3536 and second gate 3538.

In block 4938, the fabrication system strips OPL 3534 and depositsinter-layer dielectric (ILD) material 3540 upon bottom spacer 3506 and aportion of first gate 3536. In block 4940, the fabrication systemdeposits tungsten contact material 3542 on dielectric material 3540 anda portion of second gate 3538. In block 4942, the fabrication systemetches a portion of tungsten contact material 3542. In the embodiment,the fabrication system further applies an OPL 3544 to tungsten contactmaterial 3542 and second gate 3538 and lithographically patterns secondgate 3538. The fabrication system then removes OPL 3544. In theembodiment, the fabrication system deposits additional dielectricmaterial 3540 to fill recesses of structure 4700 to a top surface ofhard mask 3524.

In block 4944, the fabrication system forms a first gate contact 3546, asecond gate contact 3548, a bottom S/D contact 3550, and a top S/Dcontact 3552 within dielectric material 3540. First gate contact 3546 isformed in contact with first gate 3536 and extends to a top surface ofdielectric material 3540. Second gate contact 3548 is formed in contactwith tungsten contact material 3542 and extends to the top surface ofdielectric material 3540. Bottom S/D contact 3550 is formed in contactwith bottom S/D 3505 and extends to the top surface of dielectricmaterial 3540, and top S/D contact 3552 is formed in contact with topS/D 3522 and extends to the top surface of dielectric material 3540. Theprocess then ends. Accordingly, a VFET with dual-gate feedback loop isfabricated by the process in accordance with another embodiment.

Thus, a computer implemented method, system or apparatus, and computerprogram product are provided in the illustrative embodiments forfabricating feedback VFETs and other related features, functions, oroperations. Where an embodiment or a portion thereof is described withrespect to a type of device, the computer implemented method, system orapparatus, the computer program product, or a portion thereof, areadapted or configured for use with a suitable and comparablemanifestation of that type of device.

Where an embodiment is described as implemented in an application, thedelivery of the application in a Software as a Service (SaaS) model iscontemplated within the scope of the illustrative embodiments. In a SaaSmodel, the capability of the application implementing an embodiment isprovided to a user by executing the application in a cloudinfrastructure. The user can access the application using a variety ofclient devices through a thin client interface such as a web browser(e.g., web-based e-mail), or other light-weight client-applications. Theuser does not manage or control the underlying cloud infrastructureincluding the network, servers, operating systems, or the storage of thecloud infrastructure. In some cases, the user may not even manage orcontrol the capabilities of the SaaS application. In some other cases,the SaaS implementation of the application may permit a possibleexception of limited user-specific application configuration settings.

The present invention may be a system, a method, and/or a computerprogram product at any possible technical detail level of integration.The computer program product may include a computer readable storagemedium (or media) having computer readable program instructions thereonfor causing a processor to carry out aspects of the present invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, configuration data for integrated circuitry, oreither source code or object code written in any combination of one ormore programming languages, including an object oriented programminglanguage such as Smalltalk, C++, or the like, and procedural programminglanguages, such as the “C” programming language or similar programminglanguages. The computer readable program instructions may executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer may be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection may be made to anexternal computer (for example, through the Internet using an InternetService Provider). In some embodiments, electronic circuitry including,for example, programmable logic circuitry, field-programmable gatearrays (FPGA), or programmable logic arrays (PLA) may execute thecomputer readable program instructions by utilizing state information ofthe computer readable program instructions to personalize the electroniccircuitry, in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the blocks may occur out of theorder noted in the Figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

What is claimed is:
 1. A method for fabricating a feedback field effecttransistor, comprising: receiving a semiconductor structure including asubstrate, a first source/drain disposed on the substrate, a findisposed on the first source/drain, and a hard mask disposed on a topsurface of the fin; forming a bottom spacer on a portion of the firstsource/drain; forming a first gate upon the bottom spacer; forming asacrificial spacer upon the first gate; forming a gate spacer on thefirst gate from the sacrificial spacer; forming a second gate on thegate spacer, the gate spacer disposed between and in contact with thefirst gate and the second gate, wherein the first gate, the gate spacer,and the second gate form a portion of a dual-gate feedback loopmechanism of the feedback field effect transistor; forming a top spaceraround portions of the second gate and hard mask; forming a recess inthe top spacer and hard mask; and forming a second source/drain in therecess.
 2. The method of claim 1, further comprising: depositing adielectric material upon portions of the bottom spacer, first gate, andsecond gate.
 3. The method of claim 2, wherein the dielectric materialincludes an inter-layer dielectric material.
 4. The method of claim 2,further comprising: forming a first gate contact within the dielectricmaterial and in contact with the first gate; and forming a second gatecontact within the dielectric material and in contract with the secondgate.
 5. The method of claim 2, further comprising: forming a firstsource/drain contact within the dielectric material and in contact withthe first source/drain; and forming a second source/drain contact withinthe dielectric material and in contact with the second source/drain. 6.The method of claim 1, wherein forming the first gate further comprises:depositing a conformal gate material upon the bottom spacer and portionsof the fin; and recessing a portion of the gate material upon the bottomspacer to form the first gate.
 7. The method of claim 1, wherein formingthe second gate further comprises: depositing a conformal gate materialupon a top surface of the sacrificial spacer; and recessing a portion ofthe gate material to form the second gate.
 8. The method of claim 1,wherein the first source/drain is formed of an n-type semiconductormaterial.
 9. The method of claim 1, wherein the second source/drain isformed of a p-type semiconductor material.
 10. The method of claim 1,wherein the first gate is formed of a high dielectric constant gatematerial.
 11. The method of claim 1, wherein the gate spacer is formedof a silicon nitride (SiN) material.